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KSM26RD8/16MEI

KSM26RD8/16MEI

KSM26RD8/16MEI

Kingston Technology

KSM26RD8/16MEI datasheet pdf and Memory Cards product details from Kingston Technology stock available on our website

SOT-23

KSM26RD8/16MEI Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
ECCN (US) EAR99
HTS 8473.30.11.40
Module DRAM Module
Module Density 16Gbyte
Number of Chip per Module 18
Chip Density (bit) 8G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 2666
Chip Configuration 1Gx8
Chip Package Type FBGA
Typical Operating Supply Voltage (V) 1.2
Operating Current (mA) 1629
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Module Sides Double
ECC Support Yes
Number of Ranks Dual
CAS Latency 19
SPD EEPROM Support No
Supplier Package RDIMM
Mounting Socket
Package Height 31.25
Package Length 133.35
PCB changed 288
Part StatusObsolete
Pin Count288
Organization 2Gx72
PLL No
Self Refresh Yes
Module Type 288RDIMM
RoHS StatusRoHS Compliant
In-Stock:2831 items

About KSM26RD8/16MEI

The KSM26RD8/16MEI from Kingston Technology is a high-performance microcontroller designed for a wide range of embedded applications. This component features KSM26RD8/16MEI datasheet pdf and Memory Cards product details from Kingston Technology stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the KSM26RD8/16MEI, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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