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HX424S14IB/16

HX424S14IB/16

HX424S14IB/16

Kingston Technology

HX424S14IB/16 datasheet pdf and Memory Cards product details from Kingston Technology stock available on our website

SOT-23

HX424S14IB/16 Datasheet PDF

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Technical Specifications

Parameter NameValue
TypeParameter
Mounting Socket
Package Height 30
Package Length 69.6
PCB changed 260
Lead Shape No Lead
Supplier Package SODIMM
Standard Package Name DIM
SPD EEPROM Support Yes
CAS Latency 14
Number of Ranks Dual
ECC Support No
Module Sides Double
Maximum Operating Temperature (°C) 85
Minimum Operating Temperature (°C) 0
Typical Operating Supply Voltage (V) 1.2
Chip Package Type FBGA
Chip Configuration 1Gx8
Maximum Clock Rate (MHz) 2400
Data Bus Width (bit) 64
Chip Density (bit) 8G
Number of Chip per Module 16
Module Density 16Gbyte
Module SRAM Module
HTS 8473.30.11.40
ECCN (US) EAR99
Part StatusObsolete
Pin Count260
Organization 2Gx64
PLL No
Self Refresh Yes
Module Type 260SODIMM
RoHS StatusSupplier Unconfirmed
In-Stock:2035 items

About HX424S14IB/16

The HX424S14IB/16 from Kingston Technology is a high-performance microcontroller designed for a wide range of embedded applications. This component features HX424S14IB/16 datasheet pdf and Memory Cards product details from Kingston Technology stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the HX424S14IB/16, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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