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HX316LS9IB/4

HX316LS9IB/4

HX316LS9IB/4

Kingston Technology

HX316LS9IB/4 datasheet pdf and Memory Cards product details from Kingston Technology stock available on our website

SOT-23

HX316LS9IB/4 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
ECCN (US) EAR99
HTS 8473.30.11.40
Module DRAM Module
Module Density 4Gbyte
Number of Chip per Module 8
Chip Density (bit) 4G
Data Bus Width (bit) 64
Maximum Clock Rate (MHz) 1600
Chip Configuration 512Mx8
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.28/1.425
Typical Operating Supply Voltage (V) 1.35/1.5
Maximum Operating Supply Voltage (V) 1.45/1.575
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 85
Module Sides Double
ECC Support No
Number of Ranks Single
Number of Chip Banks 8
CAS Latency 9
SPD EEPROM Support No
Standard Package Name DIMM
Supplier Package SODIMM
Mounting Socket
Package Height 30
Package Length 67.6
PCB changed 204
Lead Shape No Lead
Part StatusActive
Pin Count204
Organization 512Mx64
PLL No
Self Refresh No
Module Type 204SODIMM
RoHS StatusYes with exemptions
In-Stock:2215 items

About HX316LS9IB/4

The HX316LS9IB/4 from Kingston Technology is a high-performance microcontroller designed for a wide range of embedded applications. This component features HX316LS9IB/4 datasheet pdf and Memory Cards product details from Kingston Technology stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the HX316LS9IB/4, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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