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11076

11076

11076

Keystone Electronics

Circuit Board Hardware - PCB .075 x .125 PTFE Pin Pin Mtg Hole .113"

SOT-23

11076 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 6 Weeks
Contact MaterialBrass
Mount Solder, Through Hole
Mounting Type Through Hole, Bottom Entry
Package / Case 125
Material - Insulation Polytetrafluoroethylene (PTFE)
Mounting Hole Diameter 0.113 (2.87mm)
PackagingBulk
Published 2007
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Press-Fit
Connector Type BOARD CONNECTOR
Insulation Color White
Contact Finish Tin
Insulation Insulated
Terminal TypePC Pin
Hole Diameter 2.8702 mm
Flange Diameter0.150 (3.81mm)
Outside Diameter3.8 mm
Terminal Style Single End
Pin Size - Above Flange 0.045 1.14mm Dia
Length 5.715mm
Length - Overall 0.225 5.72mm
Diameter - Inside 3.2 mm
Board Thickness 0.062 1.57mm
Length - Above Flange 0.200 5.08mm
RoHS StatusROHS3 Compliant
In-Stock:4029 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.660722$1.660722
10$1.566719$15.66719
100$1.478037$147.8037
500$1.394374$697.187
1000$1.315448$1315.448

About 11076

The 11076 from Keystone Electronics is a high-performance microcontroller designed for a wide range of embedded applications. This component features Circuit Board Hardware - PCB .075 x .125 PTFE Pin Pin Mtg Hole .113".

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 11076, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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