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F845RK474M760C

F845RK474M760C

F845RK474M760C

KEMET Corporation

F845RK474M760C datasheet pdf and Thin Film Capacitors product details from KEMET Corporation stock available on our website

SOT-23

F845RK474M760C Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Product Weight (g) 23
ECCN (US) EAR99
HTS 8532.25.00.30
Capacitance Value 0.47uF
Mounting Through Hole
Terminal Pitch (mm) 37.5
Suppression Class X1
Size (mm) 41 X 16.5 X 32
Wire Form Straight
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 105
Product Depth (mm) 16.5(Max)
Lead Diameter (mm) 1
Lead Length (mm) 6
Seated Plane Height (mm) 32(Max)
Maximum Operating Temperature+ 105 C
Minimum Operating Temperature - 40 C
PackagingBulk
Tolerance 20%
Part StatusNRND
Type Interference Suppression
Capacitance 0.47 uF
Subcategory Capacitors
Termination Style Radial
Dielectric PP
Lead Spacing37.5 mm
Voltage 1500VDC|760VAC
Product TypeFilm Capacitors
Product Length (mm) 41(Max)
Product Height (mm) 32(Max)
RoHS StatusRoHS Compliant
In-Stock:1700 items

About F845RK474M760C

The F845RK474M760C from KEMET Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features F845RK474M760C datasheet pdf and Thin Film Capacitors product details from KEMET Corporation stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the F845RK474M760C, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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