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F841DT334M330C

F841DT334M330C

F841DT334M330C

KEMET Corporation

F841DT334M330C datasheet pdf and Thin Film Capacitors product details from KEMET Corporation stock available on our website

SOT-23

F841DT334M330C Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Product Weight (g) 6.6
ECCN (US) EAR99
HTS 8532.25.00.20
Capacitance Value 0.33uF
Mounting Through Hole
Terminal Pitch (mm) 22.5
Suppression Class X1
Size (mm) 26 X 11 X 21.5
Wire Form Straight
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 100
Product Depth (mm) 11(Max)
Lead Diameter (mm) 0.8
Lead Length (mm) 6
Seated Plane Height (mm) 21.5(Max)
Maximum Operating Temperature+ 100 C
Minimum Operating Temperature - 40 C
PackagingBulk
Tolerance 20%
Part StatusActive
Type EMI Suppression
Capacitance 0.33 uF
Subcategory Capacitors
Termination Style Radial
Dielectric PP
Lead Spacing22.5 mm
Voltage 1000VDC|330VAC
Product TypeFilm Capacitors
Product Length (mm) 26(Max)
Product Height (mm) 21.5(Max)
RoHS StatusRoHS Compliant
In-Stock:1695 items

About F841DT334M330C

The F841DT334M330C from KEMET Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features F841DT334M330C datasheet pdf and Thin Film Capacitors product details from KEMET Corporation stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the F841DT334M330C, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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