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4ASNBW4100A3FJ

4ASNBW4100A3FJ

4ASNBW4100A3FJ

KEMET Corporation

4ASNBW4100A3FJ datasheet pdf and Thin Film Capacitors product details from KEMET Corporation stock available on our website

SOT-23

4ASNBW4100A3FJ Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
ECCN (US) EAR99
Capacitance Value 1uF
Mounting Through Hole
Terminal Pitch (mm) 37.5
Size (mm) 41.5 X 20 X 40
Wire Form Straight
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Product Depth (mm) 20
Lead Diameter (mm) 1.2
Lead Length (mm) 6
Seated Plane Height (mm) 40
Package Box
Mfr KEMET
Product Status Active
PackagingBulk
Series *
Tolerance 5%
Part StatusActive
Type Power Electronic
Construction Plastic Rectangular Can
Termination Style Radial
Dielectric PP
Voltage 600VAC|1000VDC
Product Length (mm) 41.5
Product Height (mm) 40
RoHS StatusRoHS Compliant
In-Stock:638 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$10.21000$10.21
500$10.1079$5053.95
1000$10.0058$10005.8
1500$9.9037$14855.55
2000$9.8016$19603.2
2500$9.6995$24248.75

About 4ASNBW4100A3FJ

The 4ASNBW4100A3FJ from KEMET Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features 4ASNBW4100A3FJ datasheet pdf and Thin Film Capacitors product details from KEMET Corporation stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 4ASNBW4100A3FJ, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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