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46KR42205001K

46KR42205001K

46KR42205001K

KEMET Corporation

46KR42205001K datasheet pdf and Thin Film Capacitors product details from KEMET Corporation stock available on our website

SOT-23

46KR42205001K Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
ECCN (US) EAR99
HTS 8532.25.00.10
Capacitance Value 2.2uF
Mounting Through Hole
Terminal Pitch (mm) 27.5
Suppression Class X2
Size (mm) 32 X 18 X 33
Wire Form Straight
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 110
Product Depth (mm) 18
Lead Diameter (mm) 0.8
Lead Length (mm) 25
Seated Plane Height (mm) 33
RoHS Compliant
PackagingBulk
Tolerance 10%
Part StatusActive
Type Interference Suppression
Max Operating Temperature110 °C
Min Operating Temperature -40 °C
Capacitance 2.2 µF
Depth 18 mm
Construction Plastic Rectangular Can
Termination Style Radial
Lead Pitch 27.5 mm
Dielectric PP
Lead Diameter 800 µm
Voltage 275VAC
Product Length (mm) 32
Length 32 mm
Product Height (mm) 33
RoHS StatusRoHS Compliant
Radiation HardeningNo
In-Stock:2393 items

About 46KR42205001K

The 46KR42205001K from KEMET Corporation is a high-performance microcontroller designed for a wide range of embedded applications. This component features 46KR42205001K datasheet pdf and Thin Film Capacitors product details from KEMET Corporation stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 46KR42205001K, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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