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T322B106K006AT

T322B106K006AT

T322B106K006AT

KEMET

CAP TANT 10UF 10% 6V AXIAL

SOT-23

T322B106K006AT Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 10 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Axial
Terminal Shape WIRE
Number of Pins 2
Dielectric MaterialTANTALUM (DRY/SOLID)
Operating Temperature-55°C~125°C
PackagingBulk
Published 2004
Series T322
Size / Dimension 0.110Diax0.290L 2.79mmx7.37mm
Tolerance ±10%
JESD-609 Code e3
Feature General Purpose
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Type Molded
Terminal Finish Matte Tin (Sn)
Capacitance 10μF
Voltage - Rated DC 6V
Packing Method AMMO PACK
ESR (Equivalent Series Resistance) 6Ohm
Polarity Polar
Rated (DC) Voltage (URdc) 6V
Lead Diameter 510 μm
Leakage Current 500nA
Tan Delta 0.06
Dissipation Factor6 %
Manufacturer Size Code B
Length 7.37mm
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:2167 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.45000$1.45
10$1.14600$11.46
100$0.85950$85.95
500$0.64940$324.7

About T322B106K006AT

The T322B106K006AT from KEMET is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP TANT 10UF 10% 6V AXIAL.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the T322B106K006AT, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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