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SBC6-331-871

SBC6-331-871

SBC6-331-871

KEMET

SBC6-331-871 datasheet pdf and Fixed Inductors product details from KEMET stock available on our website

SOT-23

SBC6-331-871 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 27 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Vertical Cylinder
Material - Core Ferrite
Operating Temperature-20°C~105°C
PackagingBulk
Series SBC
Published 2016
Size / Dimension 0.472Dia 12.00mm
Tolerance ±10%
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Wirewound
Shielding Unshielded
Construction Cylindrical
Current Rating870mA
Lead Length 3.5mm
Lead Spacing8.5mm
Lead Diameter 0.4 mm
Inductance 330μH
Test Frequency10kHz
DC Resistance (DCR) 410mOhm Max
Inductance Frequency - Test 10kHz
Current - Saturation 1.9A
Rated Current-Max 0.87A
Height Seated (Max) 0.591 15.00mm
RoHS StatusROHS3 Compliant
In-Stock:4393 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.213159$1.213159
10$1.144490$11.4449
100$1.079708$107.9708
500$1.018592$509.296
1000$0.960936$960.936

About SBC6-331-871

The SBC6-331-871 from KEMET is a high-performance microcontroller designed for a wide range of embedded applications. This component features SBC6-331-871 datasheet pdf and Fixed Inductors product details from KEMET stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the SBC6-331-871, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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