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PHE840MD6330KD17R06L2

  • PHE840MD6330KD17R06L2 - PHE840M 0.33μF Film Capacitor ±10% Radial PC Pins 760V-DC 275V-AC Polypropylene (PP), Metallized Through Hole
  • PHE840MD6330KD17R06L2 - PHE840M 0.33μF Film Capacitor ±10% Radial PC Pins 760V-DC 275V-AC Polypropylene (PP), Metallized Through Hole

PHE840MD6330KD17R06L2

PHE840MD6330KD17R06L2

KEMET

PHE840M 0.33μF Film Capacitor ±10% Radial PC Pins 760V-DC 275V-AC Polypropylene (PP), Metallized Through Hole

SOT-23

PHE840MD6330KD17R06L2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 31 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial
Terminal Shape WIRE
Dielectric MaterialPolypropylene (PP), Metallized
Operating Temperature-55°C~105°C
PackagingBulk
Published 2012
Series PHE840M
Size / Dimension 1.024Lx0.276W 26.00mmx7.00mm
Tolerance ±10%
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 2
Termination PC Pins
ECCN Code EAR99
Applications EMI, RFI Suppression
HTS Code8532.25.00.70
Capacitance 0.33μF
Voltage - Rated DC 760V
Depth 7mm
Voltage - Rated AC 275V
Lead Pitch 22.5mm
Capacitor Type FILM CAPACITOR
Dielectric PP
Lead Spacing0.886 22.50mm
Lead Diameter 800 μm
Height 16.5mm
Height Seated (Max) 0.650 16.50mm
Length 26mm
RoHS StatusROHS3 Compliant
Ratings X2
In-Stock:5108 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$1.096213$1.096213
10$1.034164$10.34164
100$0.975626$97.5626
500$0.920402$460.201
1000$0.868304$868.304

PHE840MD6330KD17R06L2 Product Details

PHE840MD6330KD17R06L2 Overview


Lead spacing is 0.886 22.50mm for this electrical device.Temperatures of -55°C~105°C allow the device to operate.

PHE840MD6330KD17R06L2 Features



PHE840MD6330KD17R06L2 Applications


There are a lot of KEMET PHE840MD6330KD17R06L2 applications of film capacitors.

  • Battery management system
  • Lighting
  • Electronic ballasts
  • Satellite TV
  • Coupling, decoupling
  • Blocking
  • Industrial and automotive inverters
  • Mobile communications
  • Bypassing
  • Global positioning systems

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