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EXV477M016A9PAA

EXV477M016A9PAA

EXV477M016A9PAA

KEMET

CAP ALUM 470UF 20% 16V SMD

SOT-23

EXV477M016A9PAA Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 20 Weeks
Mounting Type Surface Mount
Package / Case Radial, Can - SMD
Terminal Shape FLAT
Dielectric MaterialALUMINUM (WET)
Surface Mount Land Size 0.406Lx0.406W 10.30mmx10.30mm
Operating Temperature-55°C~105°C
PackagingTape & Reel (TR)
Series EXV
Size / Dimension 0.394Dia 10.00mm
Tolerance ±20%
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Applications General Purpose
Voltage - Rated 16V
Capacitance 470μF
Packing Method TR, 15 INCH
Capacitor Type ALUMINUM ELECTROLYTIC CAPACITOR
Rated (DC) Voltage (URdc) 16V
Size Code 4141
Lifetime @ Temp 5000 Hrs @ 105°C
Leakage Current 0.0752mA
Polarization Polar
Tan Delta 0.16
Impedance120mOhm
Ripple Current @ Low Frequency 595mA @ 120Hz
Ripple Current @ High Frequency 850mA @ 100kHz
ESR 120 mΩ
Height Seated (Max) 0.413 10.50mm
Length 12mm
Width 10.3mm
RoHS StatusROHS3 Compliant
In-Stock:24548 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About EXV477M016A9PAA

The EXV477M016A9PAA from KEMET is a high-performance microcontroller designed for a wide range of embedded applications. This component features CAP ALUM 470UF 20% 16V SMD.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the EXV477M016A9PAA, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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