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C917U680JYSDBA7317

C917U680JYSDBA7317

C917U680JYSDBA7317

KEMET

Ceramic Disc Capacitors 250volts 68pF 5% SL

SOT-23

C917U680JYSDBA7317 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 111 Weeks
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial, Disc
Terminal Shape WIRE
Operating Temperature-40°C~125°C
PackagingTape & Box (TB)
Published 2016
Series C900AC SFTY X1-400 Y2-250
Size / Dimension 0.315Dia 8.00mm
Tolerance ±5%
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Termination Radial
ECCN Code EAR99
Temperature CoefficientSL
Terminal Finish Tin (Sn)
Composition Ceramic
Applications Safety
Voltage - Rated 400VAC
Additional FeatureRATED AC VOLTAGE (V): 400
Capacitance 68pF
Packing Method AMMO PACK
Voltage - Rated AC 250V
Lead Pitch 7.493mm
Lead Spacing0.295 7.50mm
Temperature Characteristics Code SL
Multilayer Yes
Lead Style Formed Leads - Kinked
Lead/Base Style Kinked
RoHS StatusROHS3 Compliant
Ratings X1, Y2
In-Stock:34955 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About C917U680JYSDBA7317

The C917U680JYSDBA7317 from KEMET is a high-performance microcontroller designed for a wide range of embedded applications. This component features Ceramic Disc Capacitors 250volts 68pF 5% SL.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the C917U680JYSDBA7317, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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