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C320C106K3R5TA

C320C106K3R5TA

C320C106K3R5TA

KEMET

Cap Ceramic 10uF 25V X7R 10% Radial 2.54mm 125C Bulk

SOT-23

C320C106K3R5TA Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 50 Weeks
Mounting Type Through Hole
Package / Case Radial
Surface MountNO
Terminal Shape WIRE
Dielectric MaterialCERAMIC
Operating Temperature-55°C~125°C
PackagingBulk
Published 2008
Series GoldMax 300 Comm X7R
Size / Dimension 0.200Lx0.160W 5.08mmx4.07mm
Tolerance ±10%
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Temperature CoefficientX7R
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Applications General Purpose
HTS Code8532.24.00.60
Capacitance 10μF
Voltage - Rated DC 25V
Terminal Pitch2.54mm
Depth 4.064mm
Capacitor Type CERAMIC CAPACITOR
Lead Spacing0.100 2.54mm
Temperature Characteristics Code X7R
Multilayer Yes
Size Code 2016
Lead Style Straight
Height Seated (Max) 0.290 7.36mm
Length 5.08mm
RoHS StatusROHS3 Compliant
In-Stock:2677 items

Pricing & Ordering

QuantityUnit PriceExt. Price
500$1.47900$739.5

About C320C106K3R5TA

The C320C106K3R5TA from KEMET is a high-performance microcontroller designed for a wide range of embedded applications. This component features Cap Ceramic 10uF 25V X7R 10% Radial 2.54mm 125C Bulk.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the C320C106K3R5TA, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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