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C1206C152J1RAC7800

C1206C152J1RAC7800

C1206C152J1RAC7800

KEMET

C1206C152J1RAC7800 datasheet pdf and Ceramic Capacitors product details from KEMET stock available on our website

SOT-23

C1206C152J1RAC7800 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 6 Weeks
Mount Surface Mount
Package / Case 1206
Dielectric MaterialCeramic
Published 2013
Tolerance 5%
JESD-609 Code e3
Pbfree Code yes
Number of Terminations 2
ECCN Code EAR99
Temperature Coefficient-/+15ppm/Cel ppm/°C
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Max Operating Temperature125°C
Min Operating Temperature -55°C
HTS Code8532.24.00.20
Capacitance 1.5nF
Voltage - Rated DC 100V
Packing Method TR, Plastic, 7 Inch
Depth 1.6mm
Dielectric X7R
Temperature Characteristics Code X7R
Multilayer Yes
Height 780μm
Length 3.2mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
In-Stock:67155 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.12000$0.12
500$0.1188$59.4
1000$0.1176$117.6
1500$0.1164$174.6
2000$0.1152$230.4
2500$0.114$285

About C1206C152J1RAC7800

The C1206C152J1RAC7800 from KEMET is a high-performance microcontroller designed for a wide range of embedded applications. This component features C1206C152J1RAC7800 datasheet pdf and Ceramic Capacitors product details from KEMET stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the C1206C152J1RAC7800, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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