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11DB-6S(LF)

11DB-6S(LF)

11DB-6S(LF)

JST Sales America Inc.

CONN WIRE IDC 11POS 24-28AWG PCB

SOT-23

11DB-6S(LF) Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 18 Weeks
Contact MaterialPHOSPHOR BRONZE
Contact PlatingLead, Tin
Mount Press Fit, Through Hole
Mounting Type Through Hole, Press-Fit
PackagingBulk
Published 2010
Series DB
JESD-609 Code e3
Feature Closed End
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Connector Type Individual Wires
Number of Positions 11
Color White
Number of Rows 1
Additional FeatureLOW PROFILE
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts NO
Option WITH CABLE ASSEMBLY
Total Number of Contacts 11
Terminal Pitch2.5mm
Number of Positions Loaded All
Contact Finish Tin-Lead
Contact Gender MALE
UL Flammability Code 94V-0
Wire Gauge24-28 AWG, Stranded
Wire Gauge (Max) 28 AWG
Wire Gauge (Min) 24 AWG
Cable TerminationIDC
Cable Pitch 0.098 2.50mm
Board-Side Pitch 0.098 2.50mm
RoHS StatusNon-RoHS Compliant
In-Stock:14300 items

Pricing & Ordering

QuantityUnit PriceExt. Price
500$0.44218$221.09

About 11DB-6S(LF)

The 11DB-6S(LF) from JST Sales America Inc. is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN WIRE IDC 11POS 24-28AWG PCB.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 11DB-6S(LF), including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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