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SF7W008S1AE900

SF7W008S1AE900

SF7W008S1AE900

JAE Electronics

CONN SIM CARD HINGED TYPE R/A

SOT-23

SF7W008S1AE900 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Contact MaterialCopper
Mount Surface Mount
Mounting Type Surface Mount, Right Angle
Package / Case SMD/SMT
Mounting FeatureNormal, Standard - Top
Body Material Liquid Crystal Polymer, Polymer
Manufacturer Package Identifier SF7W008S1AE900
PackagingCut Tape (CT)
Published 2003
Series SF7
Feature Switch
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Connector Type Connector and Ejector
Number of Positions 8 (6 + 2)
Max Operating Temperature90°C
Min Operating Temperature -40°C
Number of Rows 2
Voltage - Rated 500V
Pitch 2.54mm
Orientation Straight
Current Rating1A
Contact Finish Gold
Approval Agency UL
Number of Contacts 8
Card Type SIM Card
Insertion, Removal Method Hinged Lid
Height 2.7mm
Length 34mm
Height Above Board 0.098 2.50mm
REACH SVHC Unknown
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
Lead Free Lead Free
In-Stock:3225 items

Pricing & Ordering

QuantityUnit PriceExt. Price
900$1.66160$1495.44

About SF7W008S1AE900

The SF7W008S1AE900 from JAE Electronics is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN SIM CARD HINGED TYPE R/A.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the SF7W008S1AE900, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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