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IL-AG9-3PL-S3L2

IL-AG9-3PL-S3L2

IL-AG9-3PL-S3L2

JAE Electronics

CONN HEADER R/A 3POS 2.5MM

SOT-23

IL-AG9-3PL-S3L2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 14 Weeks
Contact MaterialBrass
Mount Through Hole
Mounting Type Through Hole, Right Angle
Contact Shape Square
Insulation Material Polybutylene Terephthalate (PBT)
Operating Temperature-40°C~85°C
PackagingBulk
Published 2000
Series IL-AG9
Feature Board Guide
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Header
Number of Positions 3
Applications Automotive
Number of Rows 1
Gender Female
Fastening TypeLatch Holder
Contact Finish - Mating Tin
Contact Type Male Pin
Current Rating (Amps) 3A per Contact
Insulation Height 0.350 8.89mm
Style Board to Cable/Wire
Number of Positions Loaded All
Current Rating3A
Pitch - Mating 0.098 2.50mm
Insulation Color Green
Contact Length - Post 0.138 3.50mm
Shrouding Shrouded - 4 Wall
Contact Length - Mating 0.323 8.20mm
RoHS StatusRoHS Compliant
In-Stock:5495 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About IL-AG9-3PL-S3L2

The IL-AG9-3PL-S3L2 from JAE Electronics is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN HEADER R/A 3POS 2.5MM.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the IL-AG9-3PL-S3L2, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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