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FB3S021C11

FB3S021C11

FB3S021C11

JAE Electronics

CONN FPC BOTTOM 21POS 0.30MM R/A

SOT-23

FB3S021C11 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Contact MaterialCopper Alloy
Contact PlatingGold
Mount Surface Mount
Mounting Type Surface Mount, Right Angle
Housing Material Liquid Crystal Polymer (LCP), Glass Filled
Actuator MaterialPolyamide (PA), Nylon, Glass Filled
Operating Temperature-40°C~85°C
PackagingBulk
Published 2004
Series FB3
Feature Low Insertion Force (LIF)
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Number of Positions 21
Max Operating Temperature85°C
Min Operating Temperature -40°C
Voltage - Rated 50V
Current Rating (Amps) 0.35A per Contact
Pitch 0.012 0.30mm
Current Rating350mA
Contact Finish Gold
Housing Color Beige
Mating Cycles20
Flat Flex Type FPC
Connector/Contact Type Contacts, Bottom
Cable End Type Tapered
Locking Feature Flip Lock
Actuator Color Black
Height Above Board 0.075 1.90mm
FFC, FCB Thickness 0.20mm
Material Flammability Rating UL94 V-0
RoHS StatusRoHS Compliant
Flammability Rating UL94 V-0
In-Stock:1114 items

About FB3S021C11

The FB3S021C11 from JAE Electronics is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN FPC BOTTOM 21POS 0.30MM R/A.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the FB3S021C11, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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