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MWI451-17E9

MWI451-17E9

MWI451-17E9

IXYS

IGBT MODULE E9PACK

SOT-23

MWI451-17E9 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Chassis Mount
Mounting Type Chassis Mount
Package / Case Module
Transistor Element Material SILICON
Operating Temperature-40°C~125°C TJ
PackagingBulk
Published 2011
Part StatusObsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 29
Additional FeatureUL RECOGNIZED
Subcategory Insulated Gate BIP Transistors
Terminal Position UPPER
Terminal FormUNSPECIFIED
Base Part Number MWI
JESD-30 Code R-XUFM-X29
Number of Elements 6
Configuration 3 BANKS, SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE AND THERMISTOR
Case Connection ISOLATED
Transistor Application POWER CONTROL
Polarity/Channel Type N-CHANNEL
Power Dissipation-Max (Abs) 2200W
Turn On Time190 ns
Collector Current-Max (IC) 580A
Turn Off Time-Nom (toff) 870 ns
Collector-Emitter Voltage-Max 1700V
NTC ThermistorNo
Gate-Emitter Voltage-Max 20V
VCEsat-Max 2.65 V
RoHS StatusRoHS Compliant
In-Stock:1475 items

About MWI451-17E9

The MWI451-17E9 from IXYS is a high-performance microcontroller designed for a wide range of embedded applications. This component features IGBT MODULE E9PACK.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the MWI451-17E9, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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