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IXTN600N04T2

IXTN600N04T2

IXTN600N04T2

IXYS

IXTN600N04T2 datasheet pdf and Transistors - FETs, MOSFETs - Single product details from IXYS stock available on our website

SOT-23

IXTN600N04T2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 28 Weeks
Mount Chassis Mount, Screw
Mounting Type Chassis Mount
Package / Case SOT-227-4, miniBLOC
Number of Pins 4
Transistor Element Material SILICON
Operating Temperature-55°C~175°C TJ
PackagingTube
Published 2012
Series GigaMOS™, TrenchT2™
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 4
ECCN Code EAR99
Terminal Finish NICKEL
Additional FeatureUL RECOGNIZED, AVALANCHE RATED
Subcategory FET General Purpose Power
Technology MOSFET (Metal Oxide)
Terminal Position UPPER
Terminal FormUNSPECIFIED
Pin Count4
Number of Outputs 1
Output Voltage 40V
Number of Elements 1
Configuration SINGLE WITH BUILT-IN DIODE
Power Dissipation-Max 940W Tc
Nominal Supply Current200A
Operating ModeENHANCEMENT MODE
Power Dissipation940W
Output Current600A
Case Connection ISOLATED
Turn On Delay Time40 ns
FET Type N-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 1.05m Ω @ 100A, 10V
Vgs(th) (Max) @ Id 3.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 40000pF @ 25V
Current - Continuous Drain (Id) @ 25°C 600A Tc
Gate Charge (Qg) (Max) @ Vgs 590nC @ 10V
Rise Time20ns
Drive Voltage (Max Rds On,Min Rds On) 10V
Vgs (Max) ±20V
Fall Time (Typ) 250 ns
Turn-Off Delay Time 90 ns
Continuous Drain Current (ID) 600A
Gate to Source Voltage (Vgs) 20V
Avalanche Energy Rating (Eas) 3000 mJ
Radiation HardeningNo
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:205 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$25.06000$25.06
10$23.18100$231.81
100$19.79740$1979.74
500$17.54200$8771

IXTN600N04T2 Product Details

IXTN600N04T2 Description


IXTN600N04T2 is a 40V TrenchT2™ GigaMOS™ Power MOSFET. A power MOSFET is a specific metal–oxide–semiconductor field-effect transistor (MOSFET) designed to handle significant power levels. Compared to other power semiconductor devices, such as an insulated-gate bipolar transistor (IGBT) or a thyristor, its main advantages are high switching speed and good efficiency at low voltages. It shares with the IGBT an isolated gate that makes it easy to drive. They can be subject to low gain, sometimes to the degree that the gate voltage needs to be higher than the voltage under control.



IXTN600N04T2 Features


International Standard Package

miniBLOC, with Aluminium Nitride Isolation

175°C Operating Temperature

Isolation Voltage 2500 V~ z High Current Handling Capability

Fast Intrinsic Diode

Avalanche Rated

Low RDS(on)



IXTN600N04T2 Applications


DC-DC Converters and Off-Line UPS

Primary-Side Switch

High-Speed Power Switching Applications


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