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MDM1UT00SHC38LA174

MDM1UT00SHC38LA174

MDM1UT00SHC38LA174

ITTCANNONLLC

MDM1UT00SHC38LA174 datasheet pdf and Boxes product details from ITTCANNONLLC stock available on our website

SOT-23

MDM1UT00SHC38LA174 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time LAST SHIPMENTS (Last Updated: 4 days ago)
Lifecycle Status 16 Weeks
Mount Flanges
Mounting Type Surface Mount
Package / Case 8-DIP (0.300, 7.62mm)
Number of Pins 4
Operating Temperature -40°C ~ 110°C
Packaging Tube
Pbfree Code yes
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 1
ECCN Code EAR99
Temperature Coefficient -
Subcategory Other Sensors/Transducers
Voltage - Supply 20V ~ 50V
Base Part Number Lebw Xzcfe
Output Voltage 45 V
Output Type Transistor Driver
Interface I2C, SPI
Termination Type SOLDER
Operating Supply Current 1.5 mA
Nominal Supply Current 1 mA
Output Current 50 mA
Max Supply Current 800 μA
Slew Rate 0.3V/μs
Architecture -
Amplifier Type OPERATIONAL AMPLIFIER
In-Stock:3068 items

About MDM1UT00SHC38LA174

The MDM1UT00SHC38LA174 from ITTCANNONLLC is a high-performance microcontroller designed for a wide range of embedded applications. This component features MDM1UT00SHC38LA174 datasheet pdf and Boxes product details from ITTCANNONLLC stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the MDM1UT00SHC38LA174, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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