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MDM03-G51-14

MDM03-G51-14

MDM03-G51-14

ITT Cannon, LLC

CABLE ASSY D TO MICR D 51P 1.83M

SOT-23

MDM03-G51-14 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Contact MaterialCOPPER ALLOY
Insulation Material LIQUID CRYSTAL POLYMER (LCP)
Shell Material ALUMINUM ALLOY
Mounting Option 1 #4-40
Mounting Option 2 JACKPOST
Series 83513-Style Micro D Metal Shell (MDM)
Part StatusActive
Type D-Type, Micro-D
Number of Positions 51
Color Multiple, Individual
Number of Rows 3
Subcategory D Type Connectors
MIL Conformance YES
Total Number of Contacts 100
Shell Finish CADMIUM
Contact Finish Gold
Body Breadth 0.394 inch
Contact Gender FEMALE
Body Depth 0.106 inch
Rated Current (Signal) 3A
Contact Style RND PIN-SKT
Contact Resistance 8mOhm
Insulation Resistance5000000000Ohm
Mating Contact Pitch 0.05 inch
Dielectric Withstanding Voltage 900VAC V
Contact Pattern STAGGERED
Insertion Force-Max 2.224 N
Withdrawl Force-Min .139 N
1st Connector Plug, Male Pins
2nd Connector Individual Wire Leads
Contact Design PREASSEM CONN
Wire Size (Min) 32 AWG
Wire Size (Max) 26 AWG
Length 6.00' 1.83m
RoHS StatusNon-RoHS Compliant
In-Stock:4965 items

About MDM03-G51-14

The MDM03-G51-14 from ITT Cannon, LLC is a high-performance microcontroller designed for a wide range of embedded applications. This component features CABLE ASSY D TO MICR D 51P 1.83M.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the MDM03-G51-14, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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