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MDM-9SH002B

MDM-9SH002B

MDM-9SH002B

ITT Cannon, LLC

Cable Assembly Hook-up Wire 0.304m 26AWG 9 POS Micro D-Sub SKT Crimp

SOT-23

MDM-9SH002B Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Insulation Material LIQUID CRYSTALLINE POLYMER
Shell Material ALUMINUM ALLOY
Published 2006
Series MDM
Part StatusActive
Termination Crimp
Connector Type D-Sub
Type D-Type, Micro-D
Number of Positions 9
Color Multiple, Individual
Gender Female
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts NO
Option GENERAL PURPOSE
Total Number of Contacts 9
Shell Finish YELLOW CHROMATE/CADMIUM
Contact Finish Gold
Empty Shell NO
Contact Style Socket
Shell Size A
Cable Length304mm
1st Connector Receptacle, Female Sockets
2nd Connector Individual Wire Leads
Connector Type A Receptacle
Connector Type B Wire Leads
Length 1.00' 304.80mm
Radiation HardeningNo
RoHS StatusNon-RoHS Compliant
In-Stock:175 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$55.98000$55.98
5$49.10800$245.54
10$47.32800$473.28
25$44.02000$1100.5
50$41.72980$2086.49

About MDM-9SH002B

The MDM-9SH002B from ITT Cannon, LLC is a high-performance microcontroller designed for a wide range of embedded applications. This component features Cable Assembly Hook-up Wire 0.304m 26AWG 9 POS Micro D-Sub SKT Crimp.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the MDM-9SH002B, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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