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MDM-9PH034P-A174

MDM-9PH034P-A174

MDM-9PH034P-A174

ITT Cannon, LLC

CABLE ASY D TO WIRE 9P 203.2MM

SOT-23

MDM-9PH034P-A174 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mount Panel
Shell Material ALUMINUM ALLOY
Housing Material Polymer
PackagingBulk
Published 2006
Series 83513-Style Micro D Metal Shell (MDM)
Feature Shielded
Part StatusActive
Termination Wire Leads
Connector Type Plug, Signal
Type D-Type, Micro-D
Number of Positions 9
Max Operating Temperature125°C
Min Operating Temperature -55°C
Color Multiple, Individual
Number of Rows 2
Gender Male
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts NO
Option GENERAL PURPOSE
Total Number of Contacts 9
Current Rating3A
Shell Finish NICKEL
Contact Finish Gold
Empty Shell NO
Contact Style Pin
Shell Size A
1st Connector Plug, Male Pins
2nd Connector Individual Wire Leads
Length 0.667' 203.20mm 8.00
RoHS StatusNon-RoHS Compliant
In-Stock:153 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$61.51000$61.51
5$53.92800$269.64
10$51.68000$516.8
25$48.02880$1200.72
50$44.09660$2204.83

About MDM-9PH034P-A174

The MDM-9PH034P-A174 from ITT Cannon, LLC is a high-performance microcontroller designed for a wide range of embedded applications. This component features CABLE ASY D TO WIRE 9P 203.2MM.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the MDM-9PH034P-A174, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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