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DPX2-32C2S57S-33B-0002

DPX2-32C2S57S-33B-0002

DPX2-32C2S57S-33B-0002

ITT Cannon, LLC

DPX2-32C2S57S-33B-0002 datasheet pdf and Backplane Connectors - ARINC product details from ITT Cannon, LLC stock available on our website

SOT-23

DPX2-32C2S57S-33B-0002 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Panel
Package / Case 404
Insulation Material MELAMINE/PHENOLIC
Shell Material ALUMINUM ALLOY
Package Bulk
Base Product Number DPX
Mfr ITT Cannon, LLC
Product Status Active
PackagingBulk
Series *
JESD-609 Code e4
Part StatusActive
Termination Solder
ECCN Code EAR99
Gender Male
Additional FeaturePOLARIZED
HTS Code8536.69.40.30
Contact Finish - Mating GOLD
MIL Conformance NO
DIN Conformance NO
IEC Conformance NO
Filter Feature NO
Mixed Contacts YES
Option GENERAL PURPOSE
Total Number of Contacts 89
Orientation Straight
Shell Finish CADMIUM YELLOW CHROMATE
Mating Information MULTIPLE MATING PARTS AVAILABLE
Empty Shell NO
Body/Shell Style PLUG
RoHS StatusNon-RoHS Compliant
In-Stock:1999 items

About DPX2-32C2S57S-33B-0002

The DPX2-32C2S57S-33B-0002 from ITT Cannon, LLC is a high-performance microcontroller designed for a wide range of embedded applications. This component features DPX2-32C2S57S-33B-0002 datasheet pdf and Backplane Connectors - ARINC product details from ITT Cannon, LLC stock available on our website.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the DPX2-32C2S57S-33B-0002, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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