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DBMD25SJF225

DBMD25SJF225

DBMD25SJF225

ITT Cannon, LLC

CONN D-SUB RCPT 25POS R/A PCB

SOT-23

DBMD25SJF225 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 39 Weeks
Contact MaterialCopper Alloy
Mounting Type Panel Mount, Through Hole, Right Angle
Dielectric MaterialPolycyclohexylenedimethylene Terephthalate (PCT)
Shell Material, Finish Stainless Steel
Operating Temperature-55°C~125°C
PackagingBulk
Series D*M
Feature Mounting Brackets
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder
Connector Type Receptacle, Female Sockets
Number of Positions 25
Color Black
Number of Rows 2
Contact Type Signal
Current Rating (Amps) 7.5A
Contact Finish Gold
Wire Gauge20-28 AWG
Flange Feature Mating Side, Female Screwlock (4-40)
Connector Style D-Sub
Contact FormMachined
Shell Size, Connector Layout3 DB B
Backset Spacing 0.283 (7.20mm)
Material Flammability Rating UL94 V-0
RoHS StatusRoHS Compliant
In-Stock:212 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$29.949088$29.949088
10$28.253857$282.53857
100$26.654581$2665.4581
500$25.145832$12572.916
1000$23.722482$23722.482

About DBMD25SJF225

The DBMD25SJF225 from ITT Cannon, LLC is a high-performance microcontroller designed for a wide range of embedded applications. This component features CONN D-SUB RCPT 25POS R/A PCB.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the DBMD25SJF225, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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