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IS61QDP2B24M18A-333M3L

IS61QDP2B24M18A-333M3L

IS61QDP2B24M18A-333M3L

ISSI, Integrated Silicon Solution Inc

1.5/1.81.8V V 165 Pin Memory IC 17mm mm

SOT-23

IS61QDP2B24M18A-333M3L Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 165-LBGA
Surface MountYES
Number of Pins 165
Operating Temperature0°C~70°C TA
PackagingTray
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 165
ECCN Code 3A991.B.2.A
Additional FeaturePIPELINED ARCHITECTURE
HTS Code8542.32.00.41
Technology SRAM - Synchronous, QUADP
Voltage - Supply 1.71V~1.89V
Terminal Position BOTTOM
Number of Functions 1
Supply Voltage 1.8V
Terminal Pitch1mm
Pin Count165
Qualification StatusNot Qualified
Supply Voltage-Max (Vsup) 1.89V
Power Supplies1.5/1.81.8V
Supply Voltage-Min (Vsup) 1.71V
Memory Size72Mb 4M x 18
Memory TypeVolatile
Clock Frequency 333MHz
Supply Current-Max 1.15mA
Access Time 8.4ns
Memory Format SRAM
Memory InterfaceParallel
Organization 4MX18
Output Characteristics 3-STATE
Memory Width 18
Standby Current-Max 0.29A
Memory Density 75497472 bit
I/O Type SEPARATE
Standby Voltage-Min 1.7V
Height Seated (Max) 1.4mm
Length 17mm
Width 15mm
RoHS StatusROHS3 Compliant
In-Stock:108 items

Pricing & Ordering

QuantityUnit PriceExt. Price
105$93.27152$9793.5096

IS61QDP2B24M18A-333M3L Product Details

IS61QDP2B24M18A-333M3L Overview


As far as its memory type goes, it falls into the Volatile category. It is available in a case with a Tray shape. As you can see, it is embedded in 165-LBGA case. This chip has an 72Mb 4M x 18 size of memory on it, so a lot of data can be stored on it. SRAM-format memory is used in this device, which is a mainstream design. The device's extended operating temperature range of 0°C~70°C TA makes it ideal for many demanding applications. There is a voltage range of 1.71V~1.89V for the supply voltage. Its recommended mounting type is Surface Mount. The chip has 165 terminations. There are 1 functions supported by this part as part of the comprehensive working process. In order to power this memory device, 1.8V will be necessary. A clock frequency rotation within 333MHz is used for the ic memory chip to rotate data. An 165-pin package is used to package this memory device. A memory device with 165 pins means that it contains 165 memory locations, indicating that it has 165 pins. Despite all its benefits, this memory chip also offers PIPELINED ARCHITECTURE for improved system performance. Power supplies for this memory chip are merely 1.5/1.81.8V . There are SEPARATE-bit addresses mapped into the memory for I/O ports on this device. A maximum supply current of 1.15mA can be used to operate this device.

IS61QDP2B24M18A-333M3L Features


Package / Case: 165-LBGA
165 Pins
Additional Feature:PIPELINED ARCHITECTURE
I/O Type: SEPARATE

IS61QDP2B24M18A-333M3L Applications


There are a lot of ISSI, Integrated Silicon Solution Inc IS61QDP2B24M18A-333M3L Memory applications.

  • nonvolatile BIOS memory
  • embedded logic
  • hard disk drive (HDD)
  • main computer memory
  • mainframes
  • telecommunications
  • workstations,
  • Camcorders
  • eSRAM
  • eDRAM

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