IDTSTAC9202X3TAEA1XR Overview
Due to space constraints, it is supplied in the LQFP package. This package uses the Tape & Reel (TR) packaging method. Based on the Surface Mount technology, the module is mounted to a PCB. 70°C is set as the maximum operating temperature to keep the system working normally. Normal operation is maintained by setting the operating temperature low at 0°C.
IDTSTAC9202X3TAEA1XR Features
Embedded in the LQFP package
IDTSTAC9202X3TAEA1XR Applications
There are a lot of Integrated Device Technology (IDT)
IDTSTAC9202X3TAEA1XR CODECs Interface ICs applications.
- Filling
- Food & beverage
- Linear measurement
- Material handling
- Metal forming & fabrication
- Mobile equipement
- Motor feedback
- Packaging
- Printing
- Registration mark timing
