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IDT71V3559SA75BG8

IDT71V3559SA75BG8

IDT71V3559SA75BG8

Integrated Device Technology (IDT)

3.3V V -- 119 Pin Memory IC -- Series IDT71V3559 22mm mm

SOT-23

IDT71V3559SA75BG8 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case BGA
Surface MountYES
Mounting Type Surface Mount
Supplier Device Package 119-PBGA (14x22)
PackagingTape & Reel (TR)
Published 2009
Operating Temperature0°C ~ 70°C (TA)
Series --
JESD-609 Code e0
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 119
ECCN Code 3A991.B.2.A
Terminal Finish Tin/Lead (Sn63Pb37)
Max Operating Temperature70°C
Min Operating Temperature 0°C
Additional FeatureFLOW-THROUGH ARCHITECTURE
HTS Code8542.32.00.41
Voltage - Supply 3.135 V ~ 3.465 V
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch1.27mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number IDT71V3559
Pin Count119
Qualification StatusNot Qualified
Supply Voltage-Max (Vsup) 3.465V
Power Supplies3.3V
Temperature GradeCOMMERCIAL
Supply Voltage-Min (Vsup) 3.135V
Interface Parallel
Memory Size4.5Mb (256K x 18)
Memory TypeRAM, SRAM
Operating ModeSYNCHRONOUS
Clock Frequency 100MHz
Supply Current-Max 0.275mA
Access Time 7.5ns
Memory Format SRAM
Memory InterfaceParallel
Organization 256KX18
Output Characteristics 3-STATE
Memory Width 18
Write Cycle Time - Word, Page --
Standby Current-Max 0.04A
Memory Density 4718592 bit
Access Time (Max) 7.5 ns
I/O Type COMMON
Standby Voltage-Min 3.14V
Length 22mm
Height Seated (Max) 2.36mm
Width 14mm
RoHS StatusNon-RoHS Compliant
In-Stock:2755 items

IDT71V3559SA75BG8 Product Details

IDT71V3559SA75BG8 Overview


RAM, SRAM is its memory type. It is available in a case with a Tape & Reel (TR) shape. As you can see, it is embedded in BGA case. There is an 4.5Mb (256K x 18) memory capacity on the chip. In this device, the memory is of the SRAM-format, which is a popular format in the mainstream computing sector. Due to its extended operating temperature range, the device is well suited for a wide range of demanding applications. A voltage of 3.135 V ~ 3.465 V is possible to be applied to the supply. There is a recommendation that Surface Mount mounting type should be used for this product. As you can see from the diagram, the chip is planted with 119 terminations. In total, 1 functions are supported by this part. The memory device designed for this application has been designed to be powered by an 3.3V power supply. With a clock frequency of 100MHz, the memory rotates on its own. To select similar parts, many people use the device's base part number IDT71V3559. It has 119 pins indicating it has 119 memory locations. While this memory chip features many merits, it also offers FLOW-THROUGH ARCHITECTURE for improving system performance. This memory chip requires a mere 3.3V of power. In addition to this device, there are COMMON-bit memory mapped I/O port addresses on this device. Among the -- series of memory devices, this part is essential for its applications. A minimum operating temperature of 0°C must be met by this device. As a general rule, memory ics is recommended that the product be operated at temperatures no higher than 70°Cc, otherwise, damage could be done to it. This memory ics is capable of operating with an input current of 0.275mA at max.

IDT71V3559SA75BG8 Features


Package / Case: BGA
Additional Feature:FLOW-THROUGH ARCHITECTURE
I/O Type: COMMON


IDT71V3559SA75BG8 Applications


There are a lot of Integrated Device Technology (IDT)
IDT71V3559SA75BG8 Memory applications.


  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
  • embedded logic
  • eDRAM
  • graphics card
  • hard disk drive (HDD)

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