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ICS542MILF

ICS542MILF

ICS542MILF

Integrated Device Technology (IDT)

3.3V Clock Buffer DUAL 8 Pins SOIC

SOT-23

ICS542MILF Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Package / Case SOIC
Number of Pins 8
Published 1999
JESD-609 Code e3
Pbfree Code yes
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
Terminal Finish Matte Tin (Sn) - annealed
Max Operating Temperature85°C
Min Operating Temperature -40°C
Terminal Position DUAL
Terminal FormGULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count8
Qualification StatusNot Qualified
Temperature GradeINDUSTRIAL
Max Supply Voltage5V
Min Supply Voltage3V
Family 542
Logic Function Clock
Output Characteristics 3-STATE
Propagation Delay (tpd) 15 ns
Same Edge Skew-Max (tskwd) 0.5 ns
Number of True Outputs 2
Max Frequency@Nom-Sup 156000000Hz
Input Conditioning STANDARD
Height 1.5mm
Length 5mm
Width 4mm
RoHS StatusRoHS Compliant
In-Stock:4858 items

ICS542MILF Product Details

ICS542MILF Overview


It is available in the case SOIC for this cut smart buffer. There are 8 terminations in it. Using a supply voltage of 3.3V allows for high efficiency. It's in the way of Surface Mount. It has a number of pins of 8. The 8 pins are utilized for operation. At a minimum working temperature of -40°C, it maintains reliable operation. When the maximum operating temperature is set to 85°C, stable operation is ensured. It is part of the 542 family of electronic buffer ICs. It is possible to get 2 true outputs. There is a maximum supply voltage of 5VV that can be handled by this clock divider. As low as possible, the voltage source of the clock divider can be 3V.

ICS542MILF Features


8 terminations


ICS542MILF Applications


There are a lot of Integrated Device Technology (IDT)
ICS542MILF Clock Buffers & Drivers applications.


  • High performance communication system
  • Data center
  • Cloud computing
  • Network
  • High speed industry
  • High-end consumer electronics
  • Data communication
  • Telecommunications
  • Computing
  • Medical imaging

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