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70V7339S166BFG8

70V7339S166BFG8

70V7339S166BFG8

Integrated Device Technology (IDT)

Surface Mount 208 Pin Memory IC 9 Mb kb 15mm mm 790mA mA 18b b

SOT-23

70V7339S166BFG8 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 7 Weeks
Mount Surface Mount
Number of Pins 208
PackagingTape & Reel
Published 2010
JESD-609 Code e1
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 208
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Max Operating Temperature70°C
Min Operating Temperature 0°C
Additional FeatureFLOW-THROUGH OR PIPELINED ARCHITECTURE
Subcategory SRAMs
Technology CMOS
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch0.8mm
Frequency 166MHz
Time@Peak Reflow Temperature-Max (s) 30
Pin Count208
Operating Supply Voltage3.3V
Temperature GradeCOMMERCIAL
Interface Parallel
Max Supply Voltage3.45V
Min Supply Voltage3.15V
Number of Ports2
Nominal Supply Current790mA
Memory TypeRAM, SRAM
Access Time 12 ns
Output Characteristics 3-STATE
Address Bus Width19b
Density 9 Mb
Standby Current-Max 0.03A
I/O Type COMMON
Sync/Async Synchronous
Word Size18b
Length 15mm
Width 15mm
Thickness 1.4mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
Lead Free Lead Free
In-Stock:81 items

Pricing & Ordering

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70V7339S166BFG8 Product Details

70V7339S166BFG8 Overview


A RAM, SRAM-type memory can be classified as the memory type of this device. In addition, memory ics is available in a Tape & Reel case as well. A total of 208 terminations have been planted on the chip. The comprehensive working procedure of this part involves 1 functions. In order to power this memory device, 3.3V will be necessary. A 208-pin package containing this memory device is used to house this device. The memory device in question has 208 pins, thus indicating that it has 208 memory locations that can be accessed. There is a note indicating that this memory chip operates at an 3.3V volt supply voltage. The memory chip utilizes a straightforward, high-efficiency mounting method, Surface Mount mounting. There is a nominal supply current rating of 790mA for this memory component. This chip features all the merits of a conventional chip, but it also features FLOW-THROUGH OR PIPELINED ARCHITECTURE to improve system performance. 2 ports allow read/write access to one memory address in this chip. As part of the design, the I/O port addresses are mapped into the memory using an COMMON-bit number. There must not be a minimum operating temperature of less than 0°C for this device. A temperature of no more than 70°C centigrade is recommended for the component to be operated, otherwise, damage might be inflicted on the component. Usually, this memory ics falls under the SRAMs component category. Ideally, this part should be supplied with a voltage of at least 3.15V. An operating voltage of no more than 3.45V is required. A frequency of 166MHz is used to process the data on this memory chip.

70V7339S166BFG8 Features


208 Pins
Operating Supply Voltage:3.3V
Additional Feature:FLOW-THROUGH OR PIPELINED ARCHITECTURE
I/O Type: COMMON
Freguency at 166MHz
166MHz terminals


70V7339S166BFG8 Applications


There are a lot of Integrated Device Technology (IDT)
70V7339S166BFG8 Memory applications.


  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
  • embedded logic
  • eDRAM
  • graphics card

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