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70V3399S133BCI

70V3399S133BCI

70V3399S133BCI

Integrated Device Technology (IDT)

Surface Mount 256 Pin Memory IC 2.3 Mb kb 17mm mm 480mA mA 18b b

SOT-23

70V3399S133BCI Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 16 Weeks
Mount Surface Mount
Number of Pins 256
Published 2009
JESD-609 Code e0
Pbfree Code no
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish Tin/Lead (Sn63Pb37)
Max Operating Temperature85°C
Min Operating Temperature -40°C
Additional FeaturePIPELINED OR FLOW-THROUGH ARCHITECTURE
Subcategory SRAMs
Technology CMOS
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 3.3V
Terminal Pitch1mm
Frequency 133MHz
Pin Count256
Operating Supply Voltage3.3V
Temperature GradeINDUSTRIAL
Interface Parallel
Max Supply Voltage3.45V
Min Supply Voltage3.15V
Memory Size256kB
Number of Ports2
Nominal Supply Current480mA
Memory TypeRAM, SDR, SRAM
Frequency (Max) 133MHz
Access Time 4.2 ns
Output Characteristics 3-STATE
Address Bus Width34b
Density 2.3 Mb
Standby Current-Max 0.04A
I/O Type COMMON
Sync/Async Synchronous
Word Size18b
Length 17mm
Height Seated (Max) 1.7mm
Width 17mm
Thickness 1.4mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
Lead Free Contains Lead
In-Stock:95 items

Pricing & Ordering

QuantityUnit PriceExt. Price
12$103.42583$1241.10996

70V3399S133BCI Product Details

70V3399S133BCI Overview


A RAM, SDR, SRAM-type memory can be classified as the memory type of this device. On the chip, there is an 256kB memory, which is the size of the chip's memory. A total of 256 terminations have been planted on the chip. The comprehensive working procedure of this part involves 1 functions. In order to power this memory device, 3.3V will be necessary. A 256-pin package containing this memory device is used to house this device. The memory device in question has 256 pins, thus indicating that it has 256 memory locations that can be accessed. There is a note indicating that this memory chip operates at an 3.3V volt supply voltage. The memory chip utilizes a straightforward, high-efficiency mounting method, Surface Mount mounting. There is a nominal supply current rating of 480mA for this memory component. This chip features all the merits of a conventional chip, but it also features PIPELINED OR FLOW-THROUGH ARCHITECTURE to improve system performance. 2 ports allow read/write access to one memory address in this chip. As part of the design, the I/O port addresses are mapped into the memory using an COMMON-bit number. There must not be a minimum operating temperature of less than -40°C for this device. A temperature of no more than 85°C centigrade is recommended for the component to be operated, otherwise, damage might be inflicted on the component. Usually, this memory ics falls under the SRAMs component category. Ideally, this part should be supplied with a voltage of at least 3.15V. An operating voltage of no more than 3.45V is required. A frequency of 133MHz is used to process the data on this memory chip. A ic memory chip with this frequency has a maximum speed of 133MHz.

70V3399S133BCI Features


256 Pins
Operating Supply Voltage:3.3V
Additional Feature:PIPELINED OR FLOW-THROUGH ARCHITECTURE
I/O Type: COMMON
Freguency at 133MHz
133MHz terminals


70V3399S133BCI Applications


There are a lot of Integrated Device Technology (IDT)
70V3399S133BCI Memory applications.


  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory
  • Camcorders
  • embedded logic
  • eDRAM
  • graphics card

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