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70V261S55PF

70V261S55PF

70V261S55PF

Integrated Device Technology (IDT)

Surface Mount Memory IC 256 kb kb 14mm mm 140mA mA 16b b

SOT-23

70V261S55PF Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 7 Weeks
Mount Surface Mount
Package / Case TQFP
Number of Pins 100
Published 2001
Part StatusActive
Max Operating Temperature70°C
Min Operating Temperature 0°C
Operating Supply Voltage3.3V
Interface Parallel
Max Supply Voltage3.6V
Min Supply Voltage3V
Memory Size32kB
Number of Ports2
Nominal Supply Current140mA
Memory TypeRAM, SDR, SRAM
Access Time 55 ns
Address Bus Width28b
Density 256 kb
Sync/Async Asynchronous
Word Size16b
Length 14mm
Width 14mm
Thickness 1.4mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
Lead Free Contains Lead
In-Stock:2978 items

70V261S55PF Product Details

70V261S55PF Overview


In terms of its memory type, it can be classified as RAM, SDR, SRAM. The case is embedded in TQFP. Memory size on the chip is 32kB. An 100-pin package is used to package this memory device. There is a note stating that this memory chip operates at 3.3V. It uses Surface Mount mounting, which is an efficient, straightforward mounting method. As far as its nominal supply current is concerned, this memory component carries a rating of 140mA. In this chip, there are 2 ports providing read and/or write access to one memory address. A minimum operating temperature of 0°C is required for this device. It should not be operated above 70°C°C. This part should have a minimum supply voltage of at least 3V volts in order to function correctly. This part requires a minimum voltage of 3.6V.

70V261S55PF Features


Package / Case: TQFP
100 Pins
Operating Supply Voltage:3.3V


70V261S55PF Applications


There are a lot of Integrated Device Technology (IDT)
70V261S55PF Memory applications.


  • eSRAM
  • mainframes
  • multimedia computers
  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer

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