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70T3509MS133BPI

70T3509MS133BPI

70T3509MS133BPI

Integrated Device Technology (IDT)

Surface Mount 256 Pin Memory IC 36 Mb kb 17mm mm 1.37A mA 36b b

SOT-23

70T3509MS133BPI Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 14 Weeks
Mount Surface Mount
Package / Case BGA
Number of Pins 256
PackagingBulk
Published 2009
JESD-609 Code e0
Pbfree Code no
Part StatusActive
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256
Terminal Finish Tin/Lead (Sn63Pb37)
Max Operating Temperature85°C
Min Operating Temperature -40°C
Additional FeatureFLOW-THROUGH OR PIPELINED ARCHITECTURE
Subcategory SRAMs
Technology CMOS
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 2.5V
Terminal Pitch1mm
Frequency 133MHz
Time@Peak Reflow Temperature-Max (s) 20
Pin Count256
Operating Supply Voltage2.5V
Temperature GradeINDUSTRIAL
Interface Parallel
Max Supply Voltage2.6V
Min Supply Voltage2.4V
Memory Size4.5MB
Number of Ports2
Nominal Supply Current1.37A
Memory TypeRAM, SDR, SRAM
Frequency (Max) 133MHz
Access Time 4.2 ns
Organization 1MX36
Output Characteristics 3-STATE
Address Bus Width40b
Density 36 Mb
Standby Current-Max 0.08A
I/O Type COMMON
Sync/Async Synchronous
Word Size36b
Length 17mm
Width 17mm
Thickness 1.76mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
Lead Free Contains Lead
In-Stock:62 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$321.62000$321.62
12$316.85167$3802.22004
27$309.70481$8362.02987

70T3509MS133BPI Product Details

70T3509MS133BPI Overview


As far as its memory type goes, it falls into the RAM, SDR, SRAM category. You can get memory ics in a Bulk case. BGA case encloses it. There is 4.5MB of memory on the chip. There are 256 terminations on the chip. There are 1 functions supported by this part as part of the comprehensive working process. The memory device is designed to be supplied with an 2.5V volt power supply in order to operate properly. In this ic memory chip, there is an 256-pin package that encloses the device. It is worth noting that this memory device has 256 pins, which indicates it has 256 memory locations. This memory chip has an operating supply voltage of 2.5V. As a result of the Surface Mount mounting configuration, this chip is designed to be straightforward, high-efficiency, and easy to install. As far as the nominal supply current of this memory component is concerned, it is rated at 1.37A. Despite all its benefits, this memory chip also offers FLOW-THROUGH OR PIPELINED ARCHITECTURE for improved system performance. Using 2 ports, a single memory address can be read and/or written. A memory map of COMMON bits has been added to the I/O port addresses of this device. Memory ics must operate at a temperature of at least -40°C. Temperatures over 85°C°C are not recommended. There is a common misconception that this component is a type of SRAMs. If this part is to be used, the minimum supply voltage should not be less than 2.4V volts. The operating voltage of the memory ics shall not exceed 2.6V. There is an 133MHz frequency with which this memory chip processes data. In this Memory chip, the maximum frequency is 133MHz.

70T3509MS133BPI Features


Package / Case: BGA
256 Pins
Operating Supply Voltage:2.5V
Additional Feature:FLOW-THROUGH OR PIPELINED ARCHITECTURE
I/O Type: COMMON
Freguency at 133MHz
133MHz terminals


70T3509MS133BPI Applications


There are a lot of Integrated Device Technology (IDT)
70T3509MS133BPI Memory applications.


  • multimedia computers
  • networking
  • personal computers
  • servers
  • supercomputers
  • telecommunications
  • workstations,
  • DVD disk buffer
  • data buffer
  • nonvolatile BIOS memory

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