TLE9461ESV33XUMA1 Overview
Package 24-TSSOP (0.154, 3.90mm Width) Exposed Pad contains the ICs.The Tape & Reel (TR) package contains integrated circuit.A mounting method of Surface Mount is used.The System Basis Chip (SBC) is available in a wide range of integrated circuits.CAN Automotive is the appropriate place to apply the ICs.This electrical ICs application is part of the Automotive, AEC-Q100, Lite SBC series.
TLE9461ESV33XUMA1 Features
Applications : CAN Automotive
It belongs to Automotive, AEC-Q100, Lite SBC Series
TLE9461ESV33XUMA1 Applications
There are a lot of Infineon Technologies TLE9461ESV33XUMA1 Specialized ICs applications.
- Lossless generation of zero crossing signal
- Industrial Networks
- μP Switch Interfacing
- IoT Node Authentication
- MP3 Players
- PDAs and Palmtop Devices
- Peripheral Authentication
- Cell Phones
- Reference Design License Management
- PC-Based Instruments
