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PEB 20256 E V2.1

PEB 20256 E V2.1

PEB 20256 E V2.1

Infineon Technologies

PEB20256 Telecom device

SOT-23

PEB 20256 E V2.1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 388-BBGA
Supplier Device Package 388-BGA (35x35)
Operating Temperature0°C~70°C
PackagingTray
Part StatusObsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Power (Watts) 3W
Voltage - Supply 3V~3.6V
Base Part Number PEB20256
Function Multichannel Network Interface Controller (MUNICH)
Interface HDLC, PPP, Serial, TMA
Current - Supply 200mA
RoHS StatusNon-RoHS Compliant
In-Stock:3216 items

PEB 20256 E V2.1 Product Details

PEB 20256 E V2.1 Overview


Space is saved on the board by using the 388-BBGA package.Packing is done according to the Tray method.Telecommunications equipment is mounted with type Surface Mount.When 3V~3.6V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.Using 0°C~70°C as the operating temperature can result in reliable performance.By using telecom switching's base part number of PEB20256, it is possible to find more related parts.There is a supply current of 200mA for telecom equipment to operate on.

PEB 20256 E V2.1 Features


Available in the 388-BBGA package

PEB 20256 E V2.1 Applications


There are a lot of Infineon Technologies PEB 20256 E V2.1 Telecom applications.

  • Remote wireless modules
  • ISDN terminal adapter
  • Interfaces to DS3
  • Inverse Multiplexing for ATM (IMA) Wireless Base Stations
  • Integrated Access Devices
  • Frame Relay Switches and Access Devices (FRADS)
  • SONET/SDH terminal
  • Voice over packet gateways
  • Interfaces to E3
  • CSU/DSU E1 Interface

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