IRLL024NPBF Description
Fifth Generation HEXFETs achieve extraordinarily low on-resistance per silicon area by utilizing cutting-edge fabrication processes. This feature offers the designer a highly effective and dependable device for usage in a range of applications, in addition to the quick switching speed and ruggedized device architecture that HEXFET Power MOSFETs are widely known for.
The SOT-223 package is made to be surface-mounted utilizing infrared, vapor phase, or wave soldering processes. As with other SOT or SOIC packages, its distinctive package shape enables simple automatic pick-and-place, but it also has the extra benefit of increased thermal efficiency thanks to an expanded tab for heat sinking. One Watt of power can be lost in a typical surface mount application.
IRLL024NPBF Features
IRLL024NPBF Applications
Power Management
Consumer Electronics
Portable Devices
Industrial
