Name: IRFHM831TRPBF
Brand: Infineon Technologies
SKU: IRFHM831TRPBF
Availability: InStock

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IRFHM831TRPBF

Manufacturer part number:IRFHM831TRPBF

Manufacturer:Infineon Technologies

Description:IRFHM831TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website

Case Package:SOT-23

Datasheet:IRFHM831TRPBF Datasheet PDF

RoHs Status:non-compliant

Parameter Name	Value
Type	Parameter
Factory Lead Time	13 Weeks
Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	8-PowerTDFN
Number of Pins	8
Transistor Element Material	SILICON
Operating Temperature	-55°C~150°C TJ
Packaging	Tape & Reel (TR)
Published	2010
Series	HEXFET®
Part Status	Obsolete
Moisture Sensitivity Level (MSL)	1 (Unlimited)
Number of Terminations	5
ECCN Code	EAR99
Resistance	12.6MOhm
Subcategory	FET General Purpose Power
Technology	MOSFET (Metal Oxide)
Terminal Position	DUAL
JESD-30 Code	S-PDSO-N5
Number of Elements	1
Power Dissipation-Max	2.5W Ta 27W Tc
Element Configuration	Single
Operating Mode	ENHANCEMENT MODE
Power Dissipation	2.5W
Case Connection	DRAIN
Turn On Delay Time	6.9 ns
FET Type	N-Channel
Transistor Application	SWITCHING
Rds On (Max) @ Id, Vgs	7.8m Ω @ 12A, 10V
Vgs(th) (Max) @ Id	2.35V @ 25μA
Input Capacitance (Ciss) (Max) @ Vds	1050pF @ 25V
Current - Continuous Drain (Id) @ 25°C	14A Ta 40A Tc
Gate Charge (Qg) (Max) @ Vgs	16nC @ 10V
Rise Time	12ns
Drive Voltage (Max Rds On,Min Rds On)	4.5V 10V
Vgs (Max)	±20V
Fall Time (Typ)	4.7 ns
Turn-Off Delay Time	6.2 ns
Continuous Drain Current (ID)	14A
Threshold Voltage	1.8V
Gate to Source Voltage (Vgs)	20V
Drain Current-Max (Abs) (ID)	40A
Drain to Source Breakdown Voltage	30V
Pulsed Drain Current-Max (IDM)	96A
Avalanche Energy Rating (Eas)	50 mJ
Nominal Vgs	1.8 V
Height	990.6μm
Length	3.2766mm
Width	3.3mm
Radiation Hardening	No
REACH SVHC	No SVHC
RoHS Status	RoHS Compliant
Lead Free	Lead Free

IRFHM831TRPBF Product Details

IRFHM831TRPBF Description

IRFHM831TRPBF emerges as a member of HEXFET power MOSFET provided by Infineon Technologies. It is compatible with existing surface mount techniques, thus it can be manufactured in an easier way. Low thermal resistance to PCB (<4.7°C/W) enables better thermal dissipation. Low switching losses can also be realized due to low charge (typical 7.3nC). As a result, IRFHM831TRPBF is well suited for buck converters.