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IRF7329TRPBF

IRF7329TRPBF

IRF7329TRPBF

Infineon Technologies

IRF7329TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available on our website

SOT-23

IRF7329TRPBF Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Number of Pins 8
Transistor Element Material SILICON
Operating Temperature-55°C~150°C TJ
PackagingTape & Reel (TR)
Published 2004
Series HEXFET®
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
Voltage - Rated DC -12V
Max Power Dissipation2W
Terminal FormGULL WING
Current Rating-9.2A
Base Part Number IRF7329PBF
Number of Elements 2
Element ConfigurationDual
Operating ModeENHANCEMENT MODE
Power Dissipation2W
Turn On Delay Time10 ns
FET Type 2 P-Channel (Dual)
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 17m Ω @ 9.2A, 4.5V
Vgs(th) (Max) @ Id 900mV @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 3450pF @ 10V
Gate Charge (Qg) (Max) @ Vgs 57nC @ 4.5V
Rise Time8.6ns
Drain to Source Voltage (Vdss) 12V
Fall Time (Typ) 260 ns
Turn-Off Delay Time 340 ns
Continuous Drain Current (ID) 9.2A
Gate to Source Voltage (Vgs) 8V
Drain-source On Resistance-Max 0.017Ohm
Drain to Source Breakdown Voltage -12V
FET Technology METAL-OXIDE SEMICONDUCTOR
FET Feature Logic Level Gate
Height 1.4986mm
Length 4.9784mm
Width 3.9878mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:5150 items

Pricing & Ordering

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IRF7329TRPBF Product Details

IRF7329TRPBF Description

Intrative Rectifier's new P-channel HEXFET power MOSFET uses advanced technology to achieve extremely low on-resistance per silicon area. This advantage, combined with the well-known rugged device design of HEXFET Power MOSFET, provides designers with an extremely efficient and reliable device for use in a variety of applications.Over the years, SO-8 has been improved through customized thermal characteristics and multi-chip capabilities, making it an ideal choice for a variety of powerapplications.Withtheseimprovementsmultiple devices that can be used to greatly reduce circuit board space. The package is designed for gas phase, infrared or wave soldering technology.


IRF7329TRPBF Features

Trench Technology

Ultra Low On-Resistance

Dual P-Channel MOSFET

Low Profile (<1.8mm)

Available in Tape & Reel

Lead-Free

IRF7329TRPBF Applications

making it an ideal choice for a variety of powerapplications





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