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IRF7309TRPBF

IRF7309TRPBF

IRF7309TRPBF

Infineon Technologies

IRF7309TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available on our website

SOT-23

IRF7309TRPBF Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Contact PlatingTin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Number of Pins 8
Transistor Element Material SILICON
Operating Temperature-55°C~150°C TJ
PackagingTape & Reel (TR)
Published 2001
Series HEXFET®
JESD-609 Code e3
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Resistance 50mOhm
Additional FeatureULTRA LOW RESISTANCE
Subcategory Other Transistors
Max Power Dissipation1.4W
Terminal Position DUAL
Terminal FormGULL WING
Current Rating4A
Base Part Number IRF7309PBF
Number of Elements 2
Row Spacing6.3 mm
Operating ModeENHANCEMENT MODE
Power Dissipation1.4W
FET Type N and P-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 50m Ω @ 2.4A, 10V
Vgs(th) (Max) @ Id 1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 520pF @ 15V
Current - Continuous Drain (Id) @ 25°C 4A 3A
Gate Charge (Qg) (Max) @ Vgs 25nC @ 4.5V
Polarity/Channel Type N-CHANNEL AND P-CHANNEL
Turn-Off Delay Time 25 ns
Continuous Drain Current (ID) 4A
Threshold Voltage 1V
Gate to Source Voltage (Vgs) 20V
Drain Current-Max (Abs) (ID) 4A
Drain to Source Breakdown Voltage 30V
Pulsed Drain Current-Max (IDM) 16A
FET Technology METAL-OXIDE SEMICONDUCTOR
FET Feature Standard
Nominal Vgs 1 V
Height 1.4986mm
Length 4.9784mm
Width 4.05mm
Radiation HardeningNo
REACH SVHC No SVHC
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:8405 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$0.332856$0.332856
10$0.314015$3.14015
100$0.296240$29.624
500$0.279472$139.736
1000$0.263653$263.653

IRF7309TRPBF Product Details

IRF7309TRPBF Description

The fifth generation HEXFET of the International Rectifier Company uses advanced technology to achieve the lowest possible on-resistance area per silicon. This advantage, combined with HEXFET Power MOSFET's well-known fast switching speed and rough device design, provides designers with an extremely efficient device used in a variety of applications.SO-8 has been improved through a customized framework to enhance thermal and multi-chip capabilities, making it ideal for a variety of power applications. Through these improvements, a variety of devices can be used in applications that greatly reduce circuit board space. Package design for gas phase, infrared or wave soldering technology in typical printed circuit board installation applications, it is possible to consume more than 0.8W.


IRF7309TRPBF Features


Generation Technology

UltraLowOn-Resistance

Dual Nand PChannel Mosfet

Surface Mount

Availablein Tape&Reel

Dynamic dv/dt Rating

Fast Switching Lead-Free

IRF7309TRPBF Applications


This advantage, combined with HEXFET Power MOSFET's well-known fast switching speed and rough device design, provides designers with an extremely efficient device used in a variety of applications.






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