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FS3L30R07W2H3FB11BPSA2

FS3L30R07W2H3FB11BPSA2

FS3L30R07W2H3FB11BPSA2

Infineon Technologies

FS3L30R07W2H3FB11BPSA2 datasheet pdf and Transistors - IGBTs - Modules product details from Infineon Technologies stock available on our website

SOT-23

FS3L30R07W2H3FB11BPSA2 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 16 Weeks
Mounting Type Chassis Mount
Package / Case Module
Surface MountNO
Transistor Element Material SILICON
Operating Temperature-40°C~150°C TJ
Series EasyPACK™ 2B
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 32
ECCN Code EAR99
Additional FeatureUL APPROVED
Terminal Position UPPER
Terminal FormUNSPECIFIED
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-XUFM-X32
Number of Elements 12
Configuration Three Phase Inverter
Case Connection ISOLATED
Power - Max 20mW
Transistor Application POWER CONTROL
Polarity/Channel Type N-CHANNEL
Input Standard
Current - Collector Cutoff (Max) 1mA
Voltage - Collector Emitter Breakdown (Max) 650V
Current - Collector (Ic) (Max) 30A
Turn On Time88 ns
Vce(on) (Max) @ Vge, Ic 1.9V @ 15V, 30A
Turn Off Time-Nom (toff) 350 ns
IGBT Type Trench Field Stop
NTC ThermistorYes
Input Capacitance (Cies) @ Vce 1.65nF @ 25V
RoHS StatusROHS3 Compliant
In-Stock:117 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$82.625000$82.625
10$77.948113$779.48113
100$73.535956$7353.5956
500$69.373543$34686.7715
1000$65.446739$65446.739

FS3L30R07W2H3FB11BPSA2 Product Details

FS3L30R07W2H3FB11BPSA2 Description


FS3L30R07W2H3FB11BPSA2 is a 650v EasyPACK module with fast Trench/Fieldstop High-Speed 3 IGBT and SiC diode and PressFIT/NTC. The Infineon FS3L30R07W2H3FB11BPSA2 can be applied in 3-level-applications, Motor drives, Solar applications, and UPS systems applications due to the following features. The Operating and Storage Temperature Range is between -40 and 150℃. And the transistor FS3L30R07W2H3FB11BPSA2 is in the tray package.



FS3L30R07W2H3FB11BPSA2 Features


CoolSiC (TM) Schottky diode gen 5

High-speed IGBT H3

Low switching losses

3 kV AC 1min Insulation

Al2O3 substrate with low thermal resistance

Compact design

PressFIT contact technology

Rugged mounting due to integrated mounting clamps



FS3L30R07W2H3FB11BPSA2 Applications


3-level-applications

Motor drives

Solar applications

UPS systems


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