FS3L25R12W2H3B11BPSA1 Description
FS3L25R12W2H3B11BPSA1, a product marketed by Utmel Electronics and made by Infineon. It falls within the category of electronic components, ICs.
It is used in a variety of industries, including industrial, aerospace and defense, enterprise systems, personal electronics, and tablet computers. The EasyPACKTM 2B 1200 V, 25 A 3-level full-bridge IGBT module with active "Neutral Point Clamp 2" topology, NTC, High Speed IGBT H3 and PressFIT Contact Technology, AG-EASY2B-2, RoHS are the major specifications of this component. It is also environmentally friendly and RoHS compliant (lead free).
FS3L25R12W2H3B11BPSA1 Features
High Speed IGBT H3
Low switching losses
PressFIT Contact Technology
Fast Si clamping diodes 25 A 650 V
Al2O3 substrate with low thermal resistance
Rugged mounting due to integrated mounting clamps
FS3L25R12W2H3B11BPSA1 Applications
