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FP30R06W1E3B11BOMA1

FP30R06W1E3B11BOMA1

FP30R06W1E3B11BOMA1

Infineon Technologies

FP30R06W1E3B11BOMA1 datasheet pdf and Transistors - IGBTs - Modules product details from Infineon Technologies stock available on our website

SOT-23

FP30R06W1E3B11BOMA1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 16 Weeks
Mount Screw
Mounting Type Chassis Mount
Package / Case Module
Number of Pins 23
Transistor Element Material SILICON
Operating Temperature-40°C~150°C
PackagingBulk
Published 2002
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 23
ECCN Code EAR99
Additional FeatureUL APPROVED
Terminal Position UPPER
Terminal FormUNSPECIFIED
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Number of Elements 7
Configuration Three Phase Inverter
Case Connection ISOLATED
Power - Max 115W
Transistor Application POWER CONTROL
Halogen Free Not Halogen Free
Polarity/Channel Type N-CHANNEL
Input Standard
Collector Emitter Voltage (VCEO) 600V
Max Collector Current 37A
Current - Collector Cutoff (Max) 1mA
Current - Collector (Ic) (Max) 37A
Turn On Time42 ns
Vce(on) (Max) @ Vge, Ic 2V @ 15V, 30A
Turn Off Time-Nom (toff) 245 ns
IGBT Type Trench Field Stop
NTC ThermistorYes
Input Capacitance (Cies) @ Vce 1.65nF @ 25V
RoHS StatusRoHS Compliant
Lead Free Contains Lead
In-Stock:338 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$28.141360$28.14136
10$26.548453$265.48453
100$25.045710$2504.571
500$23.628029$11814.0145
1000$22.290593$22290.593

FP30R06W1E3B11BOMA1 Product Details

FP30R06W1E3B11BOMA1 Description


FP30R06W1E3B11BOMA1 IGBT module is a modular semiconductor product which is packaged by IGBT (insulated gate bipolar transistor chip) and FWD (freewheeling diode chip) through a specific circuit bridge; the packaged IGBT module is directly used in frequency converters, UPS uninterrupted power supply and other equipment. IGBT modules have the characteristics of energy saving, convenient installation and maintenance, and stable heat dissipation. IGBT module is the core device for energy conversion and transmission, commonly known as the "CPU" of power electronic devices. As a national strategic emerging industry, it is widely used in rail transit, smart grid, aerospace, electric vehicles and new energy equipment.



FP30R06W1E3B11BOMA1 Features


Low switching losses

Low VCEsat

Trench IGBT 3

VCEsat with positive temperature coefficient



FP30R06W1E3B11BOMA1 Applications


Motor drives

Air conditioning

Auxiliary inverters


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