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D3041N60TXPSA1

D3041N60TXPSA1

D3041N60TXPSA1

Infineon Technologies

DIODE GEN PURP 6KV 4090A

SOT-23

D3041N60TXPSA1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 36 Weeks
Mounting Type Chassis Mount
Package / Case DO-200AE
Surface MountYES
Diode Element Material SILICON
PackagingBulk
Part StatusActive
Moisture Sensitivity Level (MSL) Not Applicable
Number of Terminations 2
ECCN Code EAR99
HTS Code8541.10.00.80
Terminal Position END
Terminal FormNO LEAD
JESD-30 Code O-CEDB-N2
Operating Temperature (Max) 160°C
Number of Elements 1
Configuration SINGLE
Speed Standard Recovery >500ns, > 200mA (Io)
Diode Type Standard
Current - Reverse Leakage @ Vr 100mA @ 6000V
Voltage - Forward (Vf) (Max) @ If 1.7V @ 4000A
Operating Temperature - Junction -40°C~160°C
Output Current-Max 4090A
Application GENERAL PURPOSE
Voltage - DC Reverse (Vr) (Max) 6000V
Current - Average Rectified (Io) 4090A
Number of Phases 1
Rep Pk Reverse Voltage-Max 6000V
Non-rep Pk Forward Current-Max 53000A
Reverse Current-Max 100000μA
RoHS StatusNon-RoHS Compliant
In-Stock:37 items

Pricing & Ordering

QuantityUnit PriceExt. Price

About D3041N60TXPSA1

The D3041N60TXPSA1 from Infineon Technologies is a high-performance microcontroller designed for a wide range of embedded applications. This component features DIODE GEN PURP 6KV 4090A.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the D3041N60TXPSA1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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