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BSZ215CHXTMA1

BSZ215CHXTMA1

BSZ215CHXTMA1

Infineon Technologies

BSZ215CHXTMA1 datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available on our website

SOT-23

BSZ215CHXTMA1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 18 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-PowerTDFN
Number of Pins 8
Transistor Element Material SILICON
Operating Temperature-55°C~175°C TJ
PackagingTape & Reel (TR)
Published 2014
Series Automotive, AEC-Q101, OptiMOS™
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 5
Terminal Finish Tin (Sn)
Additional FeatureAVALANCHE RATED
Max Power Dissipation2.5W
Terminal Position DUAL
Terminal FormNO LEAD
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PDSO-N5
Number of Elements 2
Configuration SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE
Operating ModeENHANCEMENT MODE
Case Connection DRAIN
FET Type N and P-Channel Complementary
Rds On (Max) @ Id, Vgs 55m Ω @ 5.1A, 4.5V
Vgs(th) (Max) @ Id 1.4V @ 110μA
Halogen Free Halogen Free
Input Capacitance (Ciss) (Max) @ Vds 419pF @ 10V
Current - Continuous Drain (Id) @ 25°C 5.1A 3.2A
Gate Charge (Qg) (Max) @ Vgs 2.8nC @ 4.5V
Drain to Source Voltage (Vdss) 20V
Polarity/Channel Type N-CHANNEL AND P-CHANNEL
Continuous Drain Current (ID) 3.2A
Max Dual Supply Voltage-20V
Drain Current-Max (Abs) (ID) 5.1A
Drain-source On Resistance-Max 0.055Ohm
Pulsed Drain Current-Max (IDM) 20A
Avalanche Energy Rating (Eas) 11 mJ
FET Technology METAL-OXIDE SEMICONDUCTOR
FET Feature Logic Level Gate, 2.5V Drive
RoHS StatusROHS3 Compliant
Lead Free Lead Free
In-Stock:4398 items

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BSZ215CHXTMA1 Product Details

BSZ215CHXTMA1 Description


Fifth Generation HEXFETs from International Rectifier feature an incredibly low on-resistance per silicon area because to innovative production processes. In addition to the high switching speed and ruggedized device architecture that HEXFET Power MOSFETs are known for, this feature gives the design an extremely efficient and reliable device for usage in a range of applications. Thanks to its improved thermal properties and multiple-die capacity, the SO-8 is the best choice for a variety of power applications. This alteration was made feasible by the use of a lead frame that was specially created. This invention allows for the usage of several devices while requiring noticeably less board space. The package is designed to function with wave or vapor phase infrared soldering methods.



BSZ215CHXTMA1 Features


  • P + N complementary channel

  • Improvement mode

  • Level Super Logic (2.5V rated)

  • Common sewer

  • Rated Avalanche

  • operating temperature of 175 ??C

  • According to AEC Q101, qualified



BSZ215CHXTMA1 Applications


Switching applications


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