BSM300GB60DLCE3256HDLA1 Description
BSM300GB60DLCE3256HDLA1 developed by Infineon Technologies is a type of IGBT module which is a modular semiconductor product which is packaged by IGBT (insulated gate bipolar transistor chip) and FWD (freewheeling diode chip) through a specific circuit bridge; the packaged IGBT module is directly used in frequency converters, UPS uninterrupted power supply and other equipment. It is characterized by energy saving, convenient installation and maintenance, and stable heat dissipation.
BSM300GB60DLCE3256HDLA1 Features
Energy saving
Convenient installation
Convenient maintenance
Stable heat dissipation
BSM300GB60DLCE3256HDLA1 Applications
Rail transit
Smart grid
Aerospace
Electric vehicles
New energy equipment
