BSM300GA170DLCHOSA1 Description
BSM300GA170DLCHOSA1 developed by Infineon Technologies is a typeof IGBT module which is a modular semiconductor product which is packaged by IGBT (insulated gate bipolar transistor chip) and FWD (freewheeling diode chip) through a specific circuit bridge; the packaged IGBT module is directly used in frequency converters, UPS uninterrupted power supply and other equipment. It is characterized by energy saving, convenient installation and maintenance, and stable heat dissipation.
BSM300GA170DLCHOSA1 Features
Energy saving
Convenient installation
Convenient maintenance
Stable heat dissipation
BSM300GA170DLCHOSA1 Applications
Rail transit
Smart grid
Aerospace
Electric vehicles
New energy equipment
