AUIRF7759L2TR Descriptions
The AUIRF7759L2TR(1) combines the latest Automotive HEXFET? Power MOSFET Silicon technology with innovative DirectFET? packaging to deliver the lowest on-state resistance in a DPak (TO-252AA)-sized package with a 0.7 mm profile. When application note AN-1035 addressing manufacturing methods and processes is followed, the DirectFET? package is compatible with existing layout geometries used in power applications, PCB assembly equipment, and vapor phase, infrared, or convection soldering techniques. In automotive power systems, the DirectFET? packaging enables dual-sided cooling to enhance thermal transfer.
AUIRF7759L2TR Features
Advanced Process Technology
Optimized for Automotive Motor Drive, DC-DC, and other Heavy Load Applications
Exceptionally Small Footprint and Low Profile
High Power Density
Low Parasitic Parameters
Dual Sided Cooling
175°C Operating Temperature
Repetitive Avalanche Capability for Robustness and Reliability
Lead-free, RoHS and Halogen-free
Automotive Qualified
AUIRF7759L2TR Applications
Power Management
Consumer Electronics
Portable Devices
Industrial
