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1EDF5673FXUMA1

1EDF5673FXUMA1

1EDF5673FXUMA1

Infineon Technologies

IC DRIVER IC GAN LGA-13

SOT-23

1EDF5673FXUMA1 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 16-SOIC (0.154, 3.90mm Width)
Operating Temperature-40°C~85°C
PackagingTape & Reel (TR)
Series EiceDriver™
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Technology Capacitive Coupling
Peak Reflow Temperature (Cel) NOT SPECIFIED
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Approval Agency CQC, CSA, UL, VDE
Voltage - Isolation 1500VDC
Number of Channels 1
Current - Output High, Low 4A 8A
Rise / Fall Time (Typ) 6.5ns 4.5ns
Interface IC Type BUFFER OR INVERTER BASED PERIPHERAL DRIVER
Propagation Delay tpLH / tpHL (Max) 44ns, 44ns
Common Mode Transient Immunity (Min) 150V/ns
Pulse Width Distortion (Max) 18ns Typ
Voltage - Output Supply 3.13V~3.47V
RoHS StatusROHS3 Compliant
In-Stock:2738 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$3.689320$3.68932
10$3.480491$34.80491
100$3.283482$328.3482
500$3.097624$1548.812
1000$2.922287$2922.287

About 1EDF5673FXUMA1

The 1EDF5673FXUMA1 from Infineon Technologies is a high-performance microcontroller designed for a wide range of embedded applications. This component features IC DRIVER IC GAN LGA-13.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the 1EDF5673FXUMA1, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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